Leoni enables greater ranges when transferring data at 25 Gbit/s with a new generation of copper cables
New production technology improves the signal integrity of ParaLink 25s at more than 20 GHz
Leoni’s latest ParaLink variant represents a new milestone in the development of high-performance copper connections with low attenuation loss for broadband data transmission in computer centers. With optimized electrical properties, ParaLink 25s paves the way for such future data center standards as QSFP-DD and OSFP at a transfer rate of 400 Gbit/s, more of which via copper.
Skin 4 Speed
A new pair design provides the breakthrough: while ParaLink 23 also already does reliably transfer 25 Gbit/s per data pair via copper, a skin extruded onto the individual core pairs further optimizes the electrical transfer rates of ParaLink 25s. Thanks to this patented product design, the attenuation readings are improved by up to 20% compared with ParaLink 23. This therefore makes longer transmission paths feasible. Whereas, for example, a ParaLink 23 cable with AWG 30 transfers 25 Gbit/s across a 6.56 ft (2 m) length, ParaLink 25s achieves a 9.84 ft (3 m) transmission path with the same wire gauge. Conversely, thinner wire gauges may be used for the same transmission paths. Leoni makes ParaLink 25s cables with AWG 26, 28 and 30 as a single pair or in versions with 2, 4, 8 or 16 core pairs. The cable jacket can be specified to be made of either PVC or a halogen-free material.